design-for-chiplets integration (I)
其他資訊
1. high-level divide-and-conquer planning;
2. draft system PPA$ (performance, power, form-factor, total cost);
3. quick path-finding by CPI (chip-package iterations);
=> revised BOM/architect concepts
進一步瞭解
cloud-mode thermal assessment:
https://fusion-sip-chipthermaldesign-en.pages.dev/chip_design
design-for-chiplets integration (II)
其他資訊
4. matching IP vs. technology (process, sip, designs);
5. re-usability among applications: industry, automotive, space, etc.
6. practical design for supplychain options & operations.
=> talk to the experienced expertise.