design-for-system application (I)
其他資訊
- likely reuse the sub-system architecture (module);
- leverage chips in the markets, and create own differentiated chiplets/interface;
- strategy for design-for-supply chains;
- decent PDC (product development cycle) and time-to-markets revision.
[FAE engagement]:
cloud-mode thermal assessment:
https://fusion-sip-chipthermaldesign-en.pages.dev/chip_design
design-for-system application (II)
其他資訊
per NDA (non-disclosure agreement), we start with as-is BOM1
and discuss the to-be BOM2 migration plans.
=> high-level spec of revised BOM/architect
design-for-IP/chiplets/SiP
其他資訊
1. high-level divide-and-conquer planning;
2. draft system PPA$ (performance, power, form-factor, total cost);
3. quick path-finding by CPI (chip-package iterations);
=> revised BOM/architect concepts
[FAE engagement]:
please contract us for pros/cons, before the best fit supplychains options:
design-for-supplychain resilience
其他資訊
4. matching IP vs. technology (process, sip, designs);
5. re-usability among applications: industry, automotive, space, etc.
6. practical design for supplychain options & operations.
=> talk to the experienced expertise.
[FAE engagement]:
please contract us for pros/cons, before the best fit supplychains options:
DfM & MfD methodologies
其他資訊
DfM (design for manufacturing) &
MfD (manufacturing for design)
are complicated/comprehensive methodologies
from OEM to ODM/OBM paths.
[FAE engagement]:
please contract us for pros/cons, before the best fit supplychains options:
ex21: MEMS+CMOS/SiP accelerator
其他資訊
(it-was) MEMS 0->1 PDC maybe takes >5yrs time & efforts;
(to-be) with legacy MEMS IP+process ready (or minor trim),
we help to improve 1->2/N PDC in <2yrs,by decent, flexible
design-for-X methodologies.
[FAE engagement]:
please contract us for pros/cons, before the best fit supplychains options: